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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Standards [CURRENT]

EN 61190-1-2
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly (IEC 61190-1-2:2007)

Title (German)

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage (IEC 61190-1-2:2007)

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen

Edition 2007-06

Original language English

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Table of contents

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Daniel Failer

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Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

EN 61190-1-2 Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly (IEC 61190-1-2:2007)

Responsible national committee

Daniel Failer

EN 61190-1-2
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly (IEC 61190-1-2:2007)