NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

Proposal of the JPNC: NP-PAS - Copper-Clad Laminate for Flexible Printed Wiring Boards (Adhesive and Non-adhesive types)

Begin

2006-07-21

Planned document number

IEC 91/616/NP

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Responsible international committee

IEC/TC 91 - Electronics assembly technology  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

Send message to contact