NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Design guide for semiconductor packages - Ball Grid Array Package (BGA)
Begin
2006-04-14
Planned document number
IEC 47D/652/NP
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices