NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Proposed new package outline, Plastic small outline family, 25 mil pitch, 150 mil body width, 14, 16, 18, 20, 24 and 28 leads
Begin
2003-04-11
Planned document number
IEC 47D/543/NP
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
