NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Proposed new package outline, 3/4-land SMD (If approved, to be included in IEC 60191-2)
Begin
2002-04-12
Planned document number
IEC 47D/503/NP
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
