NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Proposal of the Japanese NC: BGA (Ball Grid Array) package measuring method
Begin
1998-11-13
Planned document number
IEC 47D/252/NP
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices