NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

IEC 62218, Ed.1: Test 5E02: Surface insulation resistance, assemblies

Abstract

This test method quantifies any deleterious effects that may arise from flux residues after soldering printed circuit boards, by measuring the decrease of surface insulation resistance.

Begin

1999-10-15

Planned document number

IEC 91/197/CD

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Responsible international committee

IEC/TC 91 - Electronics assembly technology  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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