NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

EIA/JESD22-B116 - Wire bond shear test method

Planned document number

IEC 47/1449/PAS

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Responsible international committee

IEC/TC 47 - Semiconductor devices  

Contact

Elena Rongen

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-429

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