NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

IEC 61190-1-7: Attachment materials for electronic assembly - Part-1-7: Requirements for lead free solder pastes for high quality interconnections in electronics assembly

Begin

2003-03-07

Planned document number

IEC 91/379/NP

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Responsible international committee

IEC/TC 91 - Electronics assembly technology  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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