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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Project

IEC 61190-1-6: Attachment materials for electronic assembly - Part-1-6: Requirements for electronic grade lead free solder alloys and fluxed and non-fluxed lead free solid solder for electronic soldering applications

Begin

2003-03-07

Planned document number

IEC 91/378/NP

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen

Responsible international committee

IEC/TC 91 - Electronics assembly technology

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

Send message to contact

Economic benefits

DIN SPEC

Why do standards cost money?

Get involved in standardization

Terminology