NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
IEC 60191-6-9, Ed.2: Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawing of surface mounted semiconductor device packages Design Guideline for Plastic Quad Flat Package (P-QFP)
Abstract
The project covers general rules, requirements for the outline drawings and dimensions of the Plastic Quad Flat Packages (P-QFP) for integrated circuits.
Begin
2001-02-23
Planned document number
IEC 47D/533/CD
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
