NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
IEC 60191-2, F51, Ed.1: Plastic enhanced thin profile quad flatpack (HTQFP) outline family, heat slug up T-PQFP-G (If approved, to be published as Outline 152E-a-l)
Abstract
The project specifies plastic enhanced thin profile quad flatpack (HTQFP) outline family with heat slug up T-PQFP-G.
Begin
2000-03-31
Planned document number
IEC 47D/418/CDV
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
