NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

Tape Ball Grid Array package, 0.6 mm ball diameter family (Intended for inclusion in 60191-2)

Begin

1998-02-06

Planned document number

IEC 47D/314/CD

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente  

Responsible international committee

IEC/SC 47D - Mechanical standardization for semiconductor devices  

Contact

Dr.

Konstantin Petridis

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-443

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