NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2)
Begin
1998-02-06
Planned document number
IEC 47D/210/NP
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
