NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

IEC 60191-2: Proposal for a plastic thin shrink small outline package (TSSOP/HTSSOP), 1,00 mm lead length outline family, R-PDSO-G

Abstract

This document specifies the dimensions of the Plastic Thin Shrink Small Outline Package (SSOP), 1,00 mm lead length, outline family, R-PDSO-G.

Begin

1996-04-05

Planned document number

IEC 47D/201/CDV

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente  

Responsible international committee

IEC/SC 47D - Mechanical standardization for semiconductor devices  

Contact

Dr.

Konstantin Petridis

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-443

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