NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
Abstract
This part of IEC 63378 specifies a thermal resistance and capacitance model for semiconductor packages. This model is named the Digital Transformation using thermal Resistance and Capacitance (DXRC) model. It predicts transient temperature at junction and measurement points. This document applies to semiconductor packages such as TO-243, TO-252 and TO-263. It supports single chip packages dissipated heat from single package surface.
Begin
2025-04-23
Planned document number
DIN EN IEC 63378-6
Project number
02233062
