NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Measurement method used in thermal design for electronics assemblies - Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites
Abstract
This part of IEC 63609 specifies methods for measuring the thermal conductivity of circuit boards such as FR-1, FR-4, CEM-3 and multilayer circuit boards made of polymer composites.
Begin
2024-11-19
Planned document number
DIN EN IEC 63609-2
Project number
02232707
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
