NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - wire bond pull test methods
Abstract
This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on unencapsulated or decapsulated devices. This test method may be performed on gold alloy, copper alloy, and silver alloy thermosonic (ball and stitch) bonds made of wire ranging in diameter from 15 µm to 76 µm (0,000 6” to 0,003”); and on gold alloy, copper alloy, and aluminium alloy ultrasonic (wedge) bonds made of wire ranging in diameter from 18 µm to 600 µm (0,000 7” to 0,024”)
Begin
2024-11-04
Planned document number
DIN EN IEC 60749-22-1
Project number
02232670
