NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
Abstract
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as “burn-in”, may be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this standard
Begin
2024-10-09
Planned document number
DIN IEC 60749-23
Project number
02232624
