NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
3D thermal simulation models of PBGA and FBGA packages for steady-state analysis
Abstract
This part of IEC 63378 specifies three-dimensional (3D) thermal models of PBGA (Plastic Ball Grid Array) and FBGA (Fine pitch Ball Grid Array) packages, utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.. This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.
Begin
2024-09-05
Planned document number
DIN EN IEC 63378-2-2
Project number
02232567
