NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

Model creation method using a datasheet of semiconductor device

Abstract

This part of IEC 63378-6-1 specifies a type of DXRC standardized by IEC 63378-6. This model is named the DataSheet thermal Resistance and Capacitance (DSRC) model. The DSRC model is specifically characterized by datasheets which are provided by semiconductor manufacturers and based on actual performances. This model is designed to predict transient temperatures at a junction and other specified points mentioned in datasheets. This document applies to semiconductor packages supported by IEC 63378-6.

Begin

2024-09-05

Planned document number

DIN EN IEC 63378-6-1

Project number

02232566

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente  

Contact

Elena Rongen

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-429

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