NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Abstract

This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass – fail purposes. NOTE Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using 199 solder bath and solder globule method.

Begin

2023-11-28

Planned document number

DIN EN IEC 60068-2-83

Project number

02231951

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

Send message to contact