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Field Device Integration (FDI) - Part 4: FDI Packages

Abstract

This part of IEC 62769 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1.

Begin

2022-12-08

Planned document number

DIN EN IEC 62769-4

Project number

02231337

Responsible national committee

DKE/K 956 - Industrielle Kommunikation  

Contact

Antonio Monaco

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-273

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