NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

Endurance test methods for die attach materials - Part 3: Power cycling test method for die attach materials applied to discrete type power electronic devices

Abstract

This document applies to the die attach materials and joining system applied to discrete type power electronic devices. This document specifies power cycling test method using heat-generating resistor TEG chip (herein after referred to as TEG chip), taking into account of actual usage conditions of discrete type power electronic devices to evaluate reliability of the die attach joint materials and joining system. The test method specified in this document is not intended to evaluate power semiconductor devices themselves. The test method specified in this document is not regarded as the one to be used to guarantee the reliability of the power semiconductor device packages.

Begin

2022-10-14

Planned document number

DIN EN IEC 63215-3

Project number

02231247

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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