DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English
Abstract
This document specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as Known Good Module.
Begin
2022-07-07
Planned document number
DIN EN IEC 62878-2-603
Project number
02231109
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
draft standard
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English
2023-07
Order from DIN Media
