DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 61189-2-720:2024); German version EN IEC 61189-2-720:2024
Abstract
This document provides a method to evaluate specific characteristics of printed circuit boards by measuring the capacitance between conductor trays and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
Begin
2022-04-21
Planned document number
DIN EN IEC 61189-2-720
Project number
02230983
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
draft standard
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 91/1786/CD:2022); Text in German and English
2022-09
Order from DIN Media
