DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020); Text in German and English
Abstract
This part of IEC 61189 defines the method to be followed for the determination of the X/Y 122 coefficient of thermal expansion of thin electrical insulating materials via the use of a 123 thermomechanical analyser (TMA). This method is applicable to materials that are solid for the 124 entire range of temperature used, and that retain sufficient rigidity over the temperature range 125 so that so that irreversible indentation of the specimen by the sensing probe does not occur.
Begin
2021-01-05
Planned document number
DIN EN IEC 61189-2-805
Project number
02229950
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
draft standard
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020); Text in German and English
2022-03
Order from DIN Media
