NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English

Abstract

This document is applicable to test thermal resistance of dielectric layer of printed circuit board using thermal transient method.

Begin

2020-12-10

Planned document number

DIN EN IEC 61189-2-808

Project number

02229915

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

draft standard

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
2022-03
Order from DIN Media

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

Send message to contact