DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 61189-2-804:2023); German version EN IEC 61189-2-804:2023
Abstract
This part of IEC 61189 specifies a test method to determine the time to delamination of laminates and printed boards through the use of a thermomechanical analyzer (TMA). Typically the temperatures utilized in this analysis are but not limited to 260, 288 and 300 °C.
Begin
2019-01-09
Planned document number
DIN EN IEC 61189-2-804
Project number
02228679
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
draft standard
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 91/1546/CD:2018); Text in German and English
2019-05
Order from DIN Media
