DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023); German version EN IEC 61189-2-803:2023
Abstract
This part of IEC 61189 specifies a test method to determine the Z-Axis Expansion of laminates and printed boards through the use of a thermomechanical analyzer (TMA).
Begin
2019-01-09
Planned document number
DIN EN IEC 61189-2-803
Project number
02228678
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
draft standard
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board (IEC 91/1545/CD:2018); Text in German and English
2019-05
Order from DIN Media
