NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions (IEC 47A/996/CD:2016)

Abstract

This technical information is to provide general conditions and defidnitions of multichip integrated circuits, which is vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions are provided that are related to the fabrication and test of the multichip integrated circuits.

Begin

2017-01-24

Planned document number

DIN EN 63011-1

Project number

02227382

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Contact

Elena Rongen

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-429

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