NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

Future IEC 62326-17; Printed boards-Device Embedded Substrate-TEG(test element group)

Begin

2011-09-02

Planned document number

IEC 91/997/NP

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Responsible international committee

IEC/TC 91 - Electronics assembly technology  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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