NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Future IEC 62047-22: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Begin
2011-07-29
Planned document number
IEC 47F/96/NP
Responsible national committee
DKE/K 631 - Halbleiterbauelemente