NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
IEC 62047-16, Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
Begin
2012-07-27
Planned document number
IEC 47F/125/CD
Responsible national committee
DKE/K 631 - Halbleiterbauelemente
