NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
Begin
2013-02-22
Planned document number
IEC 47F/149/CD
Responsible national committee
DKE/K 631 - Halbleiterbauelemente