NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
IEC 62047-15 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass
Begin
2012-08-03
Planned document number
IEC 47F/126/CD
Responsible national committee
DKE/K 631 - Halbleiterbauelemente