NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
IEC 60191-2 f68 Ed.1: Proposed new package outline - flange mounted package with through hole leads, P-SFM-T3 - To be published as outline 186F, if approved.
Begin
2010-11-19
Planned document number
IEC 47D/818/CDV
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
