NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

IEC 60191-2 f68 Ed.1: Proposed new package outline - flange mounted package with through hole leads, P-SFM-T3 - To be published as outline 186F, if approved.

Begin

2010-11-19

Planned document number

IEC 47D/818/CDV

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente  

Responsible international committee

IEC/SC 47D - Mechanical standardization for semiconductor devices  

Contact

Dr.

Konstantin Petridis

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-443

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