NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (Future IEC 62047-11)
Begin
2008-08-22
Planned document number
IEC 47F/5/NP
Responsible national committee
DKE/K 631 - Halbleiterbauelemente