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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (Future IEC 62047-11)

Begin

2008-08-22

Planned document number

IEC 47F/5/NP

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Responsible international committee

IEC/SC 47F - Micro-electromechanical systems  

Contact

Elena Rongen

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-429

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