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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Project

(Future IEC 62047-18): Semiconductor devices - Micro-electromechanical devices - Part 18: Micro electro mechanical devises - Bending test methods of thin film materials

Begin

2010-02-26

Planned document number

IEC 47F/47/NP

Responsible national committee

DKE/K 631 - Halbleiterbauelemente

Responsible international committee

IEC/SC 47F - Micro-electromechanical systems

Contact

Elena Rongen

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-429

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Economic benefits

DIN SPEC

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Terminology