NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (Future IEC 62047-10)
Begin
2008-08-22
Planned document number
IEC 47F/4/NP
Responsible national committee
DKE/K 631 - Halbleiterbauelemente