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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Project

(Future IEC 62047-15): Semiconductor devices -Micro-electromechanical devices - Part 15: Test method for bond strength in PDMS/Glass chip

Begin

2009-10-30

Planned document number

IEC 47F/38/NP

Responsible national committee

DKE/K 631 - Halbleiterbauelemente

Responsible international committee

IEC/SC 47F - Micro-electromechanical systems

Contact

Elena Rongen

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-429

Send message to contact

Economic benefits

DIN SPEC

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Terminology