NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-15:2009)

Abstract

This part of IEC 61249 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-35 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.

Begin

2007-04-06

Planned document number

prEN 61249-4-15

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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