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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

Mechanical standardization for semiconductor devices - Part 2: Dimensions - Pin plastic fine pitch ball grid array package (P-FBGA) family for memory

Begin

2001-01-19

Planned document number

prEN 60191-2

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente  

Contact

Dr.

Konstantin Petridis

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-443

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