NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
IEC 2326-3-1: Printed boards - Part 3: Rigid single and double-sided printed boards with interlayer connections - Section 1: Capability detail specification - Performance level A, B and C
Begin
1996-10-04
Planned document number
IEC 52/677/CD
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen