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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Project

Proposal of USNC: Proposed new package outline - 13 Pin reduced size MultiMediaCard (MMC) outline MMCmobile 18×24×1,4 mm (Intended to become IEC 60191-2/F65, if approved)

Begin

2006-11-24

Planned document number

IEC 47D/674/NP

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente

Responsible international committee

IEC/SC 47D - Mechanical standardization for semiconductor devices

Contact

Dr.

Konstantin Petridis

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-443

Send message to contact

Economic benefits

DIN SPEC

Why do standards cost money?

Get involved in standardization

Terminology