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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Project

Proposal of the Korean NC: (Future IEC 62047-9): Semiconductor devices - Micro-electromechanical devices - Part 9: Bonding strength measurement in MEMS packaging

Begin

2007-03-30

Planned document number

IEC 47/1907/NP

Responsible national committee

DKE/K 631 - Halbleiterbauelemente

Responsible international committee

IEC/TC 47 - Semiconductor devices

Contact

Elena Rongen

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-429

Send message to contact

Economic benefits

DIN SPEC

Why do standards cost money?

Get involved in standardization

Terminology