NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Proposal of the Korean NC: (Future IEC 62047-8): Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
Begin
2007-03-30
Planned document number
IEC 47/1906/NP
Responsible national committee
DKE/K 631 - Halbleiterbauelemente