NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

Project

Proposal of the Korean NC: (Future IEC 62047-8): Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

Begin

2007-03-30

Planned document number

IEC 47/1906/NP

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Responsible international committee

IEC/TC 47 - Semiconductor devices  

Contact

Elena Rongen

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-429

Send message to contact