NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
NP-PAS: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Begin
2006-12-15
Planned document number
IEC 47D/677/NP
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
