NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Projects of NA 022

Number: 8,336

DIN EN IEC 61753-085-03 2025-04-24 Fibre optic interconecting devices and passive components - Performance Standard - Part 085-03: Non-connectorized single-mode pigtailed CWDM devices for category OP - Outdoor protected environment More  Comment 
DIN EN IEC 61238-1-1/A1 2025-04-24 Compression and mechanical connectors for power cables - Part 1-1: Test methods and requirements for compression and mechanical connectors for power cables for rated voltages up to 1 kV (Um = 1,2 kV) tested on non-insulated conductors More  Comment 
DIN EN IEC 61238-1-2/A1 2025-04-24 Compression and mechanical connectors for power cables - Part 1-2: Test methods and requirements for insulation piercing connectors for power cables for rated voltages up to 1 kV (Um = 1,2 kV) tested on insulated conductors More  Comment 
DIN EN IEC 61238-1-3/A1 2025-04-24 Compression and mechanical connectors for power cables - Part 1-3: Test methods and requirements for compression and mechanical connectors for power cables for rated voltages above 1 kV (Um = 1,2 kV) up to 30 kV (Um = 36 kV) tested on non-insulated conductors More  Comment 
DIN EN 60099-4 2025-04-24 Surge arresters - Part 4: Metal-oxide surge arresters without gaps for a.c. systems (IEC 60099-4:2014); German version EN 60099-4:2014 More  Comment 
DIN EN IEC 60598-2-23 2025-04-24 Luminaires - Part 2-23: Particular requirements - Extra-low-voltage lighting systems for ELV light sources More  Comment 
DIN CLC IEC/TS 62443-6-2 2025-04-24 Security for industrial automation and control systems - Part 6-2: Security evaluation methodology for IEC 62443-4-2 More  Comment 
DIN EN IEC 61300-2-58 2025-04-24 Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-58: Tests - Resistance test of immersion cooling environments More  Comment 
DIN EN IEC 63378-3 2025-04-23 Thermal standardization on semiconductor packaging - Part 3: Thermal circuit simulation models of semiconductor packages for transient analysis More  Comment 
DIN EN IEC 63378-6 2025-04-23 Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points More  Comment 

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