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Hydrogen Technologies Standards form the basic framework for market ramp-up
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Climate change Standards and specifications support climate targets
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Smart Farming Standards and specifications are drivers for the digitalization of agriculture
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Projects of IEC/TC 47

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IEC 47/2155/CDV	2012-03-02	IEC 60749-28 Ed.1: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing Direct contact charged device model (DC-CDM) More	Comment
IEC 47/2080/NP	2010-11-12	IEC 60749-28: Electrostatic Discharge (ESD) Sensitivity Testing Direct contact charged device model (DC-CDM) More	Comment
IEC 47/2073A/DTR	2010-09-10	IEC/TR 62258-4 Ed.2: Semiconductor die products - Part 4: Questionnaire for die users and suppliers More	Comment
IEC 47/2064/NP	2010-07-16	Future IEC 62435: Long-term storage of electronic semiconductor devices More	Comment
IEC 47/2082/FDIS	2009-09-04	IEC 60749-21 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability More	Comment
IEC 47/2083/FDIS	2009-09-04	IEC 60749-29 Ed.2: SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - Part 29: Latch-up test More	Comment
IEC 47/2019/CDV	2009-07-31	IEC 60749-30 Amend 1 Ed.1: Semiconductor devices - Mechanical and climatic test methods -Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing More	Comment
IEC 47/2087/FDIS	2009-07-31	IEC 60749-7 Ed.2: Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases More	Comment
IEC 47F/31/CDV	2008-11-28	IEC 62047-9,Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS More	Comment
IEC 47/1987/DC	2008-08-22	Maintenance of IEC 60747-1 Ed. 2.0: Semiconductor devices - Part 1: General More	Comment

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